About
Personal Data
1995.02 ~ 1998.02 Kongju National University High School
1998.02 ~ 2006.01 Hanyang University, ERICA
2005.12 ~ Test&Package Center, Samsung Electronics(Semiconductor)
e-mail : jaoneol@gmail.com
Github : https://github.com/ds2man
Linkedln : https://www.linkedin.com/in/ds2man
Main Project
[AI]ML/Statistics-based Machine Failure Prediction(2023)
- Predicting Failure Probabilities in LOP & LPR Areas in Advance Using
Statistics and Machine Learning
by Analyzing Data fromTest Equipment with Design Rules
through EDA
[AI]Pre-Crack Detection System for Wheel Mark Wafers Using Deep Learning(2020)
- Preventing Quality Defects(Cracks) in Wheel Mark Wafers Using
Deep Learning
by EDA onDie-Attach and BackLap Equipment Log Data
[SW]Development of Machine Analysis System(2017)
- Planning and Improvement Activities for a System to Analyze Equipment Performance
Using Log Data Generated Within the Equipment
[SW]Automated Program for Package Chip Data Conversion(2013)
- Development of a System to Trace EDS to Package Data by
Converting Chips within a Package Based on EDS Data
[SW]Multi-Lot Processing in Back-End Test Equipment(2010)
- Continuous Input of Same-Type Lots in Equipment to Reduce Lot Processing Time and Establish an Infrastructure for
Package Chip Data Tracing
Lectures
T-Expert Program: Introduction to Statistics(2021~)
Samsung Data Scientist Certification(Statistics) Fast-Track Course(2019~)
Awards
2023 Data Science Festival
Host : Samsung Electronics Memory Division, led by the Division Head
Topic : ML/Statistics based Machine Failure Prediction
Award : Good Practice
2017 TSP Paper Competition
Host : Samsung Electronics TSP Division
Topic : Development of Machine Analysis System
Award : Bronze